常规X射线成像很大程度上依靠便捷的工具来评估各检测系统的性能,也就是分辨率测试卡。Yxlon International和Microworks现在已经签署了一项许可协议,Microworks将把与Yxlon International共同开发的分辨率测试卡商业化,并面向全球市场。该分辨率测试卡使用了Microworks在高纵横比精细结构制备上积累多年的X射线光刻经验,提供了17个测试区域,布局如下。可以检测0.3µm到5um的分辨率,并采用了厚度超过3µm的金作为吸收材料,以获得更好的X射线衬度对比。
分辨率测试卡参数
标准Yxlon 测试卡

Outer Dimensions | 8 mm x 8 mm chip size |
Materials | Substrate: 200 µm thick silicon Absorber: 3 µm high gold |
Line/Space Widths | Tolerance: +/- 10% |
Pattern Line Widths [µm] | 5.0, 4.0, 3.2, 2.5, 2.0, 1.6, 1.3, 1.0, 0.9, 0.8, 0.7, 0.6, 0.5, 0.45, 0.4, 0.35, 0.3 (17 steps) |
标准NanoXSpot测试卡

Outer Dimensions | 10 mm x 10 mm chip size Holder with saphire glass cover: 40 mm x 30 mm x 5 mm |
Materials | Substrate: 200 µm thick silicon Absorber: 8 µm high gold |
Line/Space Widths | Tolerance: +/- 15% |
Pattern Line Widths [µm] | 4 quadrants of 4 mm x 4 mm each; 2 modified Siemens stars featuring circular holes and 5 parallel gold lines, with line and space widths of 12 µm, 10 µm, 8 µm, 6 µm, 5 µm, 4 µm, and 3 µm at different angles. Smallest line width: 3 µm. Smallest hole diameter: 5 µm |
定制化分辨率测试卡:
提供客户要求(设计,吸收体高度,尺寸等)进行定制。
分辨率测试卡参数
Outer dimension | 8 mm x 8 mm chip size |
Materials | Substrate: 200 μm thick silicon, Absorber: 3 μm high gold |
L/S widths | Tolerance: +/-10% |
Pattern period [μm] | 5.0, 4.0, 3.2, 2.5, 2.0, 1.6, 1.3, 1.0, 0.9, 0.8, 0.7, 0.6, 0.5, 0.45, 0.4, 0.35, 0.3 (17 steps) |
