GDMS

GD90 Trace

The GD90 Trace, the GDMS instrument from MSI, features a proven optical platform with innovative modern stable electronics and control. All voltages are under computer control providing unsurpassed ea

  • Model: GD90 Trace


The GD90 Trace, the GDMS instrument from MSI, features a proven optical platform with innovative modern stable electronics and control. All voltages are under computer control providing unsurpassed ease of use with a simple USB interface to the control, acquisition and processing PC. Remote control of the instrument and hardware control of acquisition are also incorporated.


Advantages of GDMS

  • Full elemental analysis of major (wt%) to ultra-trace elements (ppb to sub-ppb) within a single scan

  • Direct solid sampling technique, thus alleviating the need for chemical digestion

  • Continuously variable high resolution capabilities from<400 to="">10,000 RP (10% valley definition)

  • Dual collectors allowing up to 12 orders of linear dynamic range

  • A proven technique for high sensitivity depth-dependent distribution analysis of trace elements in coatings and other multi-layered advanced materials

  • Minimal matrix effects allow calibration without matrix matched standards by using Relative Sensitivity Factors (RSF)


Features of the GD90 Trace

  • Tantalum cell and source construction for ease of cleaning

  • Availability of cryo-cooling of the GD cell to minimise gas backgrounds

  • Accommodates both pin and flat cell geometries

  • No mass bias for light/heavy elements

  • Calibration consists of a quick check of 180Ta and 181Ta to ensure that the IC and Faraday detectors are in agreement

  • Low gas flow allows for cost-effective use of an alternate ionisation gas such as krypton

  • Ability to analyse a wide range of samples ranging from alloys to high purity materials (both conductive and non-conductive), in a plethora of sample geometries

  • Low sputter rate – at normal analytical conditions the sputter rate ranges from 150 nm/minute (conductive) to 100 nm/minute (non-conductive); lowering operational conditions allows sputter rate to be slowed by at least 5x

  • RSFs and Detection Limit determinations are derived from published, readily sourced methods

  • Front end assembly allows for the fitting of a custom-designed glove box for nuclear applications