Technical Specs Sensor Material: Si Sensor Thickness: 300 μm, 500 μm and 675 μm for Si Sensitive Area: 14 mm X 14 mm Readout Speed: 30 frames/s&n

  • Model:
Technical Specs
 Sensor Material: Si
 Sensor Thickness: 300 μm, 500 μm and 675 μm for Si
 Sensitive Area: 14 mm X 14 mm
 Readout Speed: 30 frames/s
 Connectivity: USB 2.0 
 Number of Pixels: 256 X 256
 Pixel Pitch: 55 μm
 Pixel Mode of Operation: Counting, Time-over-Threshold, Time-of -Arrival
 Minimum Detectable Energy: 5 keV for X-rays
 Threshoid Step Resolution: 0.1 keV
 Energy Resolution: 0.8 keV (THL) and 2 keV (ToT)
 Pixel Photon Counting Speed: 1e5 photons/s/pixel
 Readout Chip: Timepix
 Resolution: 9 lp/mm
 Weight: 50 g
 Dimensions: 60 mm x 12 mm x 5 mm (L x W x H)
 Software: Pixet and Pixelman