Laser Direct Writing
Leveraging cutting-edge equipment and extensive experience, we provide customers with one-stop solutions from design to finished products, covering core technologies such as electron beam lithography, laser direct writing, X-ray lithography, two-photon polymerization, extreme ultraviolet (EUV) laser interference lithography, ultraviolet lithography, and electroplating. The product line includes Fresnel zone plates, nanoscale gratings, diamond optical components, nanoscale resolution test targets, and 3D resolution test targets. Fresnel zone plates can achieve resolution as low as <10 nm, and with our unique Ir-line multiplication technology, X-ray beam focusing down to 5 nm can be achieved.
By inducing physical or chemical changes in materials (such as ablation, decomposition, polymerization, etc.) through a focused laser beam, precise fabrication of micro- and nanoscale structures is achieved. This technology requires no mask, allows flexible control of laser parameters, and offers higher material compatibility and faster processing speed compared to electron beam lithography, making it suitable for large-scale production.
Heidelberg DWL66+ 200mm Direct Laser Writer system
High-precision laser writing with single-point feature sizes down to 300 nm.
Typical applications:
- Microlens arrays
- Diffractive optical elements (DOEs)
- Fabrication of 2.5D topological structures such as holograms
DWL66fs UV direct laser writing system
The 355 nm wavelength laser can pattern high-sensitivity SU-8 photoresist with thicknesses far exceeding what electron beam lithography can achieve. Precise control is ensured by interferometric measurement, guaranteeing high accuracy.
Typical applications:
- Direct CAD data patterning of high-contrast X-ray masks.
- Fabrication of complex microlens arrays and diffractive optical elements.
FROM READING TO APPLICATION
Put this knowledge to work
Need to assess product suitability, discuss experimental conditions or find technical support? Explore our products and services, or discuss this resource with us.