EUV laser interference lithography
Leveraging cutting-edge equipment and extensive experience, we provide customers with one-stop solutions from design to finished products, covering core technologies such as electron beam lithography, laser direct writing, X-ray lithography, two-photon polymerization, extreme ultraviolet laser interference lithography, ultraviolet lithography, and electroplating. The product line includes Fresnel zone plates, nanoscale gratings, diamond optical components, nanoscale resolution test targets, and 3D resolution test targets. Fresnel zone plates can achieve resolutions as low as <10 nm, and with our unique Ir-line multiplication technology, X-ray beam focusing can be achieved with precision down to 5 nm.
Extreme‑ultraviolet laser interference lithography is an advanced micro‑nano fabrication method that combines extreme‑ultraviolet light (typically at a wavelength of 13.5 nm) with interference optical technology. Through the interference of two or more coherent extreme‑ultraviolet laser beams, a light field with periodic intensity distribution is formed to directly expose photoresist and generate high‑precision nanoscale patterns on substrates. It is suitable for the efficient fabrication of large‑area periodic structures.
Phable R200 lithography system
The minimum feature size is 60 nm, which is suitable for the patterning of large‑area periodic structures.
Supports 8‑inch wafer processing with exposure uniformity better than 3%.
Provides front‑side alignment and manual overlay alignment functions to ensure high‑precision processing.
Typical Applications
Large‑area nanopattern lithography, suitable for mass production
Fabrication of diffraction gratings and other periodic structures
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