Ultraviolet Lithography‑Mask Aligners
Leveraging cutting-edge equipment and extensive experience, we provide customers with one-stop solutions from design to finished products, covering core technologies such as electron beam lithography, laser direct writing, X-ray lithography, two-photon polymerization, extreme ultraviolet laser interference lithography, ultraviolet lithography, and electroplating. The product line includes Fresnel zone plates, nanoscale gratings, diamond optical components, nanoscale resolution test targets, and 3D resolution test targets. Fresnel zone plates can achieve resolutions as low as <10 nm, and with our unique Ir-line multiplication technology, X-ray beam focusing can be achieved with precision down to 5 nm.
Ultraviolet lithography is a technique that uses ultraviolet light to transfer patterns onto photoresist through a mask, and the Mask Aligner is the key equipment for implementing this technique. It precisely transfers fine patterns on the mask to photoresist‑coated silicon wafers. This process demands not only extremely high alignment accuracy but also high production efficiency. The advent of the Mask Aligner has greatly advanced the development of semiconductor technology, enabling more complex and intricate circuits, and it is suitable for mass production and multi‑material patterning.
Equipment: SUSS MA8-BA6 、SUSS MA6-BA6
Supports precise alignment and exposure for 6/8‑inch wafers, with a resolution of up to 800 nm.
Provide top‑and‑bottom alignment options to ensure high‑precision pattern transfer.
Typical Applications
Pattern transfer for a wide range of materials, applicable to fields such as semiconductors and optical devices.
Processing of membranous wafers and other special substrates.
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