Detection Principle

Penetrating imaging: Utilizes the ability of X-rays to penetrate materials, generating images through differences in X-ray absorption by different materials (e.g., solder, silicon wafers, metal wires).

High-resolution imaging: Micron-level resolution enables detection of minute defects (e.g., solder ball voids below 5 μm).

Main Detection Targets 

• Solder joint defects:

Voids: Detects whether bubbles exist inside the solder, as these bubbles can affect electrical conductivity and heat dissipation.

Solder bridging: Identifies short circuits between adjacent solder joints to ensure proper circuit connections.

Cold solder joints: Checks whether the solder has fully melted to avoid performance issues caused by poor connections.

• Internal structural defects:

Wire bonding: Detects whether wires are broken or displaced to ensure stable signal transmission.

Chip cracking and delamination: Timely detection of cracks and delamination inside the chip to prevent device failure.

• Packaging alignment issues:

Misalignment between chip and substrate: Ensures precise alignment between the chip and substrate to improve packaging quality.

Bump distribution uniformity in flip-chip: Detects whether bump distribution is uniform to ensure good electrical connections.

Technical Advantages

• Non-destructive testing: Compared with traditional cross-section analysis methods, X-ray imaging technology does not damage samples, effectively saving costs.

• Real-time monitoring: Supports online real-time inspection, enabling timely detection of quality issues during production and improving production efficiency.

• High sensitivity: Possesses excellent defect identification capability, accurately detecting hidden defects such as voids beneath BGA solder balls.

Typical Application Scenarios

Packaging process development: With our solutions, you can optimize bonding parameters (e.g., temperature, pressure), reduce defects during packaging, and improve product quality.

Mass production quality control: We provide full inspection or sampling inspection services to ensure packaged devices meet quality standards and improve yield.

Failure analysis (FA): With our technology, you can quickly locate fault points inside the package and identify the root causes of product failure.

Chip reverse engineering: Our solutions also help you analyze the packaging structure design of competitor chips, providing a reference for independent R&D.

Solution Implementation Process - Full-Service from Requirement Communication to Final Deployment

We understand that each customer's specific requirements and application scenarios are unique. Therefore, we provide customized X-ray imaging and spectroscopy solutions. From preliminary communication to understand requirements, to theoretical simulation and experimental validation, and finally to the deployment of the solution, we participate throughout and provide professional support. Our goal is to ensure that every customer obtains the most suitable solution to achieve optimized quality control.